National Instruments Measurement Science and Technology produced the whole wafer inspection apparatus for a variety of wafer sizes and materials, measuring instruments. 

 Product Series models include manual, semi-automatic and fully automatic three models. Can measure, including Si, GaAs, InP, Ge, etc. Almost all of the material, powerful software features to the test wafer in the thickness of a few seconds, TTV, bow, warp and flatness, in addition to the software by adding a module to calculate wafer in the process before and after the stress. All calculations are consistent with ASTM (ASTM) and the Semi standards to ensure compatibility with other process equipment and uniform. 

 Model 1: Proforma300 manual mode: 

 Features: Fast, accurate, reliable, measurable, maximum 300mm (12 ") wafer thickness, TTV, bow, measured by non-contact capacitance probe access. Wafers bearing units are special brush lun material, can be realized wear-free wafer to facilitate location, location when the wafer moves through the thimble can be accurately calibrated. test results through high-resolution LCD display. connected to a computer through the RS-232 interface mode can be completely computer monitoring and control, and through the printer output. 

 Process parameter setting is convenient, Proforma300 lets users of non-contact measurement accurate, rapid, accurate and reproducible. 

 The distance between the probe tip and wafer can be adjusted according. 

 Type II: Proforma 200SA/300SA semi-automatic measurement 

 Proforma 200SA/300SA across the wafer can be achieved fast, full surface scan, the wafer manually loaded by the automatic load stage, press the start button when using automatic measurements can be carried out, can be the thickness, TTV, bow, warp and flatness measurements. 

 Proforma 200SA/300SA wafer thinning process in the series is the ideal tool for process development and process monitoring, through the convenient windows interface to perform complex data analysis and provide the data list and three-dimensional map. 

 Capable of measuring process like cutting, grinding, etching, wafer polishing and plate making, provide fast and accurate process information. 

 Data reporting, format diversity and full network functionality enables users to process information in any of the steps to understand 

 Each measurement parameters and system parameters can be selected friendly software interface, the parameters may also need to be modified and re-calculated without the need to re-scan on the wafer. 

 In addition to the powerful measurement capabilities, users can choose to add a software, the software can be used to measure wafer stress. According to Stoney equation or process can be calculated after thin film deposition, the stress introduced into the wafer. 

 For off-line, remote data analysis and machine settings, we can provide powerful data tools package, which is based on observation windows system the number of network